Electronic circuit board manufacturing process for antenna and transmission line
The invention, which belongs to the technical field of electronic circuit board making, discloses an electronic circuit board manufacturing process for an antenna and a transmission line. The manufacturing process comprises: the surface of a non-conductive substrate is pasted with a photosensitive m...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | JIANG HAIYING MAO SHUANGFU JIANG LAIXIN WU HAO |
| description | The invention, which belongs to the technical field of electronic circuit board making, discloses an electronic circuit board manufacturing process for an antenna and a transmission line. The manufacturing process comprises: the surface of a non-conductive substrate is pasted with a photosensitive material layer; exposing and developing are carried out and a region needing circuit manufacturing isexposed completely; micro hole drilling is carried out in the region; dense metal layers are deposited on the photosensitive material layer, in the circuit manufacturing region, and in the micro holeby using a vacuum sputtering deposition technique; an alkaline material solution is used for dissolution to remove the photosensitive material layer and the metal layer on the photosensitive materiallayer; and then the thicknesses of the metal layers deposited in the circuit manufacturing region and the micro hole are increased by means of electroplating or chemical plating. According to the invention, the obtained electr |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN108174521A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN108174521A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN108174521A3</originalsourceid><addsrcrecordid>eNqNyjsOwjAMANAuDAi4gzkAEuUjWFFVxIQY2CvjOshS6kR2cn8YOADTW968efSRqVhSISAxqlLgldBGmFBrQCrVRN-QLRG7Q0gGqIVV8esIxVB9EndJClGUl80sYHRe_Vw062v_7G4bzmlgz0isXIbu3m7P7elw3LWX_T_nA_A-N_g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic circuit board manufacturing process for antenna and transmission line</title><source>esp@cenet</source><creator>JIANG HAIYING ; MAO SHUANGFU ; JIANG LAIXIN ; WU HAO</creator><creatorcontrib>JIANG HAIYING ; MAO SHUANGFU ; JIANG LAIXIN ; WU HAO</creatorcontrib><description>The invention, which belongs to the technical field of electronic circuit board making, discloses an electronic circuit board manufacturing process for an antenna and a transmission line. The manufacturing process comprises: the surface of a non-conductive substrate is pasted with a photosensitive material layer; exposing and developing are carried out and a region needing circuit manufacturing isexposed completely; micro hole drilling is carried out in the region; dense metal layers are deposited on the photosensitive material layer, in the circuit manufacturing region, and in the micro holeby using a vacuum sputtering deposition technique; an alkaline material solution is used for dissolution to remove the photosensitive material layer and the metal layer on the photosensitive materiallayer; and then the thicknesses of the metal layers deposited in the circuit manufacturing region and the micro hole are increased by means of electroplating or chemical plating. According to the invention, the obtained electr</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180615&DB=EPODOC&CC=CN&NR=108174521A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180615&DB=EPODOC&CC=CN&NR=108174521A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIANG HAIYING</creatorcontrib><creatorcontrib>MAO SHUANGFU</creatorcontrib><creatorcontrib>JIANG LAIXIN</creatorcontrib><creatorcontrib>WU HAO</creatorcontrib><title>Electronic circuit board manufacturing process for antenna and transmission line</title><description>The invention, which belongs to the technical field of electronic circuit board making, discloses an electronic circuit board manufacturing process for an antenna and a transmission line. The manufacturing process comprises: the surface of a non-conductive substrate is pasted with a photosensitive material layer; exposing and developing are carried out and a region needing circuit manufacturing isexposed completely; micro hole drilling is carried out in the region; dense metal layers are deposited on the photosensitive material layer, in the circuit manufacturing region, and in the micro holeby using a vacuum sputtering deposition technique; an alkaline material solution is used for dissolution to remove the photosensitive material layer and the metal layer on the photosensitive materiallayer; and then the thicknesses of the metal layers deposited in the circuit manufacturing region and the micro hole are increased by means of electroplating or chemical plating. According to the invention, the obtained electr</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjsOwjAMANAuDAi4gzkAEuUjWFFVxIQY2CvjOshS6kR2cn8YOADTW968efSRqVhSISAxqlLgldBGmFBrQCrVRN-QLRG7Q0gGqIVV8esIxVB9EndJClGUl80sYHRe_Vw062v_7G4bzmlgz0isXIbu3m7P7elw3LWX_T_nA_A-N_g</recordid><startdate>20180615</startdate><enddate>20180615</enddate><creator>JIANG HAIYING</creator><creator>MAO SHUANGFU</creator><creator>JIANG LAIXIN</creator><creator>WU HAO</creator><scope>EVB</scope></search><sort><creationdate>20180615</creationdate><title>Electronic circuit board manufacturing process for antenna and transmission line</title><author>JIANG HAIYING ; MAO SHUANGFU ; JIANG LAIXIN ; WU HAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108174521A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>JIANG HAIYING</creatorcontrib><creatorcontrib>MAO SHUANGFU</creatorcontrib><creatorcontrib>JIANG LAIXIN</creatorcontrib><creatorcontrib>WU HAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIANG HAIYING</au><au>MAO SHUANGFU</au><au>JIANG LAIXIN</au><au>WU HAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic circuit board manufacturing process for antenna and transmission line</title><date>2018-06-15</date><risdate>2018</risdate><abstract>The invention, which belongs to the technical field of electronic circuit board making, discloses an electronic circuit board manufacturing process for an antenna and a transmission line. The manufacturing process comprises: the surface of a non-conductive substrate is pasted with a photosensitive material layer; exposing and developing are carried out and a region needing circuit manufacturing isexposed completely; micro hole drilling is carried out in the region; dense metal layers are deposited on the photosensitive material layer, in the circuit manufacturing region, and in the micro holeby using a vacuum sputtering deposition technique; an alkaline material solution is used for dissolution to remove the photosensitive material layer and the metal layer on the photosensitive materiallayer; and then the thicknesses of the metal layers deposited in the circuit manufacturing region and the micro hole are increased by means of electroplating or chemical plating. According to the invention, the obtained electr</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN108174521A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Electronic circuit board manufacturing process for antenna and transmission line |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T08%3A04%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JIANG%20HAIYING&rft.date=2018-06-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN108174521A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |