Electronic circuit board manufacturing process for antenna and transmission line

The invention, which belongs to the technical field of electronic circuit board making, discloses an electronic circuit board manufacturing process for an antenna and a transmission line. The manufacturing process comprises: the surface of a non-conductive substrate is pasted with a photosensitive material layer; exposing and developing are carried out and a region needing circuit manufacturing isexposed completely; micro hole drilling is carried out in the region; dense metal layers are deposited on the photosensitive material layer, in the circuit manufacturing region, and in the micro holeby using a vacuum sputtering deposition technique; an alkaline material solution is used for dissolution to remove the photosensitive material layer and the metal layer on the photosensitive materiallayer; and then the thicknesses of the metal layers deposited in the circuit manufacturing region and the micro hole are increased by means of electroplating or chemical plating. According to the invention, the obtained electr