Method for manufacturing semiconductor encapsulation device by laser
The invention discloses a method for manufacturing a semiconductor encapsulation device by laser. In combination with a laser technology, as a semiconductor is encapsulated by a ceramic material serving as a substrate, the precision is high, and the manufacturing complexity is relatively low; meanwh...
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| creator | HUANG ZHENGXIN WANG GUOQING CHU HONGSHEN SONG XUGUAN WANG HUANJU |
| description | The invention discloses a method for manufacturing a semiconductor encapsulation device by laser. In combination with a laser technology, as a semiconductor is encapsulated by a ceramic material serving as a substrate, the precision is high, and the manufacturing complexity is relatively low; meanwhile, an end electrode is provided for the encapsulation device, and can be directly assembled to anelectrical appliance module; and therefore, the space is saved, and the assembling efficiency of the electrical appliance module is improved.
本发明公开了种激光制造半导体封装器件的方法，结合激光技术，以陶瓷材料为基板封装半导体，精度高，制作复杂度交低，同时为封装器件提供端电极，可直接组配于电器模组，即节省空间，又提升电器模组组装的效率。 |
| format | Patent |
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本发明公开了种激光制造半导体封装器件的方法，结合激光技术，以陶瓷材料为基板封装半导体，精度高，制作复杂度交低，同时为封装器件提供端电极，可直接组配于电器模组，即节省空间，又提升电器模组组装的效率。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180615&DB=EPODOC&CC=CN&NR=108172522A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180615&DB=EPODOC&CC=CN&NR=108172522A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG ZHENGXIN</creatorcontrib><creatorcontrib>WANG GUOQING</creatorcontrib><creatorcontrib>CHU HONGSHEN</creatorcontrib><creatorcontrib>SONG XUGUAN</creatorcontrib><creatorcontrib>WANG HUANJU</creatorcontrib><title>Method for manufacturing semiconductor encapsulation device by laser</title><description>The invention discloses a method for manufacturing a semiconductor encapsulation device by laser. In combination with a laser technology, as a semiconductor is encapsulated by a ceramic material serving as a substrate, the precision is high, and the manufacturing complexity is relatively low; meanwhile, an end electrode is provided for the encapsulation device, and can be directly assembled to anelectrical appliance module; and therefore, the space is saved, and the assembling efficiency of the electrical appliance module is improved.
本发明公开了种激光制造半导体封装器件的方法，结合激光技术，以陶瓷材料为基板封装半导体，精度高，制作复杂度交低，同时为封装器件提供端电极，可直接组配于电器模组，即节省空间，又提升电器模组组装的效率。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDxTS3JyE9RSMsvUshNzCtNS0wuKS3KzEtXKE7NzUzOz0spTS4ByqXmJScWFJfmJJZk5ucppKSWZSanKiRVKuQkFqcW8TCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeGc_QwMLQ3MjUyMjR2Ni1AAADRkzdg</recordid><startdate>20180615</startdate><enddate>20180615</enddate><creator>HUANG ZHENGXIN</creator><creator>WANG GUOQING</creator><creator>CHU HONGSHEN</creator><creator>SONG XUGUAN</creator><creator>WANG HUANJU</creator><scope>EVB</scope></search><sort><creationdate>20180615</creationdate><title>Method for manufacturing semiconductor encapsulation device by laser</title><author>HUANG ZHENGXIN ; WANG GUOQING ; CHU HONGSHEN ; SONG XUGUAN ; WANG HUANJU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108172522A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG ZHENGXIN</creatorcontrib><creatorcontrib>WANG GUOQING</creatorcontrib><creatorcontrib>CHU HONGSHEN</creatorcontrib><creatorcontrib>SONG XUGUAN</creatorcontrib><creatorcontrib>WANG HUANJU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG ZHENGXIN</au><au>WANG GUOQING</au><au>CHU HONGSHEN</au><au>SONG XUGUAN</au><au>WANG HUANJU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for manufacturing semiconductor encapsulation device by laser</title><date>2018-06-15</date><risdate>2018</risdate><abstract>The invention discloses a method for manufacturing a semiconductor encapsulation device by laser. In combination with a laser technology, as a semiconductor is encapsulated by a ceramic material serving as a substrate, the precision is high, and the manufacturing complexity is relatively low; meanwhile, an end electrode is provided for the encapsulation device, and can be directly assembled to anelectrical appliance module; and therefore, the space is saved, and the assembling efficiency of the electrical appliance module is improved.
本发明公开了种激光制造半导体封装器件的方法，结合激光技术，以陶瓷材料为基板封装半导体，精度高，制作复杂度交低，同时为封装器件提供端电极，可直接组配于电器模组，即节省空间，又提升电器模组组装的效率。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Method for manufacturing semiconductor encapsulation device by laser |
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