Method for manufacturing semiconductor encapsulation device by laser

The invention discloses a method for manufacturing a semiconductor encapsulation device by laser. In combination with a laser technology, as a semiconductor is encapsulated by a ceramic material serving as a substrate, the precision is high, and the manufacturing complexity is relatively low; meanwhile, an end electrode is provided for the encapsulation device, and can be directly assembled to anelectrical appliance module; and therefore, the space is saved, and the assembling efficiency of the electrical appliance module is improved. 本发明公开了种激光制造半导体封装器件的方法，结合激光技术，以陶瓷材料为基板封装半导体，精度高，制作复杂度交低，同时为封装器件提供端电极，可直接组配于电器模组，即节省空间，又提升电器模组组装的效率。