一种细微盲孔直流电镀填孔药水

本发明公开了一种细微盲孔直流电镀填孔药水，包括润湿剂、高效抑制剂、加速剂和整平剂，润湿剂起到增加铜面润湿性的作用，避免因孔内铜离子消耗未及时而产生孔内空洞。高效抑制剂有效吸附在孔口附近，阻止孔口铜生长，改善了细微盲孔孔口处电镀铜生长过快导致的包孔现象。加速剂可进入孔内并随电镀进行快速富集，以使孔内镀速高于孔外镀速，达到高效填孔的效果。整平剂与孔口处负电荷密集的部位结合，抑制孔口镀铜的速度，避免产生孔内空洞。上述组分协同作用，实现了对细微、高厚径比盲孔的高效电镀填孔，通过直流电镀即可完成填孔工艺，成本低廉，填孔效率、质量高，对设备要求低，适宜于处理孔径低于60μm、厚径比大于1的盲孔填孔工艺。 The invention discloses a hole filling liquid medicine for direct current electroplating of a micro blind hole. The hole filling liquid medicine comprises a wetting agent, an efficient inhibitor, an accelerator and a leveling agent, wherein the wetting agent plays a role in increasing the wettability of a copper surface, so that holes in the hole are prevented from being generated due to the factthat copper ions in the hole are not consumed in time. According to the hole filling liquid medicine, the efficient inhibitor is effectively adsorbed in the vicinity of a hole opening, and copper growth of the hole opening is prevented, so that the hole wrapping phenomenon caused by too fast growth of the electroplating cop