Grinding pad and manufacturing method thereof
The invention relates to a grinding pad and a manufacturing method of the grinding pad, and is characterized in that when the grinding process is carried out, a slurry is not required to be used, or agrinding pad in an adjusting procedure and other manufacturing methods are not required. The grindin...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a grinding pad and a manufacturing method of the grinding pad, and is characterized in that when the grinding process is carried out, a slurry is not required to be used, or agrinding pad in an adjusting procedure and other manufacturing methods are not required. The grinding pad is formed by a self-adjusting forming body coating with waterborne polyurethane, the dissolution rate can be controlled. When the grinding process of the grinded body is carried out, extra slurry does not need to be used, and additional adjustment procedures do not need to be carried out. Idle time of the device is avoided, and the production performance of the grinding process can be improved. The grinding pad comprises grinding auxiliary materials, so that the grinding performance is improved.
本发明涉及研磨垫及其的制作方法,更详细地,涉及当进行研磨工序时,无需使用浆料和/或无需调节工序的研磨垫及其他制作方法。本发明具有如下效果,通过本发明制作的研磨垫用水性聚氨酯涂敷自调节成型体,由此可控制溶出速度,当进行被研磨体的研磨工序时,不使用额外的浆料,不需要进行额外的调节工序,因此没有装置的空闲时间,从而可提高研磨工序的生产性。并且,本发明具有如下效果,通过本发明制作的研磨垫包括研磨辅料,从而提高研磨性能。 |
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