Dicing Sheet with Protective Film Forming Layer and Chip Fabrication Method

The invention provides a dicing sheet with a protective film forming layer that makes it possible to easily fabricate a semiconductor chip having a protective film with high film thickness uniformityand excellent printing accuracy, and that is expandable and uses a heat resistant substrate material....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHINODA TOMONORI, TAKANO KEN, FURUDATE MASAAKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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