Dicing Sheet with Protective Film Forming Layer and Chip Fabrication Method

The invention provides a dicing sheet with a protective film forming layer that makes it possible to easily fabricate a semiconductor chip having a protective film with high film thickness uniformityand excellent printing accuracy, and that is expandable and uses a heat resistant substrate material. The dicing sheet with a protective film forming layer according to the present invention has a substrate film, an adhesive layer, and a protective film forming layer, and at a minimum, the adhesive layer is formed in an area surrounding the protective film forming layer in a planar view, and the substrate film has the following characteristics (a)-(c): (a) the melting point either exceeds 130 DEG C or the film has no melting point; (b) the thermal contraction rate under conditions of heating at 130 DEG C for two hours is from -5 to +5%, and (c) the degree of elongation-to-break in the MD direction and the CD direction is at least 100%, and the stress at 25% is no more than 100 MPa. 本发明的课题是提供具有保护膜形成层的切割膜片，其可简便地制造具有