Metal material heat shrinkage parameter measuring device for 3D printing analogue simulation
The invention relates to a metal material heat shrinkage parameter measuring device for 3D printing analogue simulation. The device comprises a data collection analysis system, a displacement transducer, a sliding block, a bolt, a thermoelectric couple and a T-shaped groove. The T-shaped groove is u...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a metal material heat shrinkage parameter measuring device for 3D printing analogue simulation. The device comprises a data collection analysis system, a displacement transducer, a sliding block, a bolt, a thermoelectric couple and a T-shaped groove. The T-shaped groove is used for containing metal melt, the sliding block is located in the T-shaped groove and can slide along the T-shaped groove, the bolt is connected with the sliding block, the bolt extends into the interior of the metal melt when the bolt is used, the sliding block is driven by the bolt to slide whenthe metal melt solidifies and retracts, the displacement transducer is connected with the sliding block and used for collecting displacement data of the sliding block, the thermoelectric couple is arranged in the T-shaped groove and used for collecting temperature variation of the melt in the T-shaped groove, the data collection analysis system is connected with the displacement transducer and thethermoelectric couple for |
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