Thermosetting resin composition, prepreg, laminated board and printed circuit board

The invention provides a thermosetting resin composition, prepreg, a laminated board and a printed circuit board. The thermosetting resin composition is prepared from thermosetting resin, an inorganicfiller and a porous molybdenum compound. The thermosetting resin composition, the prepreg, the laminated board and the printed circuit board provided by the invention have the beneficial effects thatby use of the porous molybdenum compound as a solid lubricant, the problem of dispersion and sedimentation of the molybdenum compound can be effectively solved, and the molybdenum compound can be uniformly distributed in the prepreg; due to better heat conductivity of the porous molybdenum compound, the heat can be better conducted in drilling, the resin can be prevented from sticking on a drilling cutter after being molten, simultaneously the conditions such as hole cracking also can be reduced and the hole-wall quality after drilling can be obviously improved. 本公开提供热固性树脂组合物、预浸料、层压板和印制电路板。所述热固性树脂组合物包括：热固性树脂、无机填料以及多孔钼