Styryl polysilicon phenylate resin as well as preparation method and application of styryl polysilicon phenylate resin

The invention provides a styryl polysilicon phenylate resin as well as a preparation method and application of the styryl polysilicon phenylate resin. The styryl polysilicon phenylate resin provided by the invention has a structure as shown in a formula I. A main chain in the structure of the styryl polysilicon phenylate resin comprises a siloxy structure and a benzene ring structure. A styryl isintroduced into an end group of a polysilicon phenylate resin, so that not only is a curing way realized by means of the styryl curing achieved, but also the low dielectric property and high heat resistance of a phenylate structure are combined with the weatherability, flame resistance, dielectric property and low water absorption of a siloxy group; and the styryl polysilicon phenylate resin is applied to the field of copper clad plates and can provide favorable dielectric property and heat resistance required by a high-frequency and high-speed copper clad plate. 本发明提供种苯乙烯基聚硅苯醚树脂及其制备方法和应用，本发明的苯乙烯基聚硅苯醚树脂具有式I所示的结构，在其结构的