Circuit board socket with rail frame

The present invention discloses various apparatus and methods of electrically connecting a packaged integrated circuit to a circuit board (20). In one aspect, an apparatus (10) includes a first frame(40) to be mounted on the circuit board (20) and having a first end. An insulating housing (60) is ad...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MAHESH S. HARDIKAR, STEPHEN F. HENG, SANJAY DANDIA
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present invention discloses various apparatus and methods of electrically connecting a packaged integrated circuit to a circuit board (20). In one aspect, an apparatus (10) includes a first frame(40) to be mounted on the circuit board (20) and having a first end. An insulating housing (60) is adapted to be mounted on the circuit board and positioned in the first frame. A second frame (80) ispivotally coupled to the first frame. The second frame includes two spaced-apart rail members (760, 770) and a cross member (810) coupled to and between the rail members opposite the first end of thesecond frame. The rail members are operable to receive the packaged integrated circuit (30). The second frame has at least one engagement member (862) to engage a first portion of the insulating housing when the second frame is pivoted toward the insulating housing. A third frame (90) is pivotally coupled to the first frame to apply force to the packaged integrated circuit. 公开将封装集成电路(30)电连接到电路板(20)的各种设备和方法。在方面,种设备(10)包括将安装在