Optoelectronic component and method for producing same

An optoelectronic component comprises a carrier and a first optoelectronic semi-conductor chip which is arranged on a top side of the carrier. A housing material is arranged over the top side of the carrier. A cavity is formed in the housing material. A top side of the first optoelectronic semi-cond...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LISTL STEFAN, SINGER FRANK, HOXHOLD BJOERN, SCHWARZ THOMAS
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!