Optoelectronic component and method for producing same

An optoelectronic component comprises a carrier and a first optoelectronic semi-conductor chip which is arranged on a top side of the carrier. A housing material is arranged over the top side of the carrier. A cavity is formed in the housing material. A top side of the first optoelectronic semi-conductor chip is arranged in the cavity. A first electrical terminal face of the first optoelectronic semi-conductor chip on the top side of the first optoelectronic semi-conductor chip is connected by an electrically conductive bonding wire to a first contacting surface on the top side of the carrier.A first section of the bonding wire is arranged in the cavity. A second section of the bonding wire is embedded in the housing material. 种光电子部件包括载体和布置在载体的顶侧上的第光电子半导体芯片。壳体材料布置在载体的顶侧之上。腔体形成在壳体材料中。第光电子半导体芯片的顶侧布置在腔体中。在第光电子半导体芯片的顶侧上的第光电子半导体芯片的第电气连接端面通过电气传导接合线连接至载体的顶侧上的第接触表面。该接合线的第区段布置在腔体中。该接合线的第二区段嵌入在壳体材料中。