Liquid jetting device

The present invention relates to a liquid jetting device. To prevent ink mists from adhering to an integrated circuit or a circuit board, the integrated circuit or the circuit board may be hermetically sealed with a chassis, and the integrated circuit may malfunction due to heat generated in the int...

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Bibliographische Detailangaben
Hauptverfasser:	TOMOKI HOSHINO, TOMOMI IIJIMA, KEIZABUROU YAMAMOTO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STAMPS TRANSPORTING TYPEWRITERS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention relates to a liquid jetting device. To prevent ink mists from adhering to an integrated circuit or a circuit board, the integrated circuit or the circuit board may be hermetically sealed with a chassis, and the integrated circuit may malfunction due to heat generated in the integrated circuit. A liquid jetting device includes a chassis, a plurality of nozzles from which a liquid can be ejected, pressure chambers, each being in communication with an associated nozzle in the plurality of nozzles, pressure generation elements associated with each pressure chamber and configured to cause a liquid pressure change in an associated pressure chamber, an integrated circuit held inside the chassis and configured to drive the pressure generation elements, a circuit board connected to the integrated circuit and configured to supply an electrical signal to the integrated circuit, and a heat-conductive part to support the circuit board, the heat-conductive part being held by the chassis to contact the