Semiconductor device with wettable corner leads and semiconductor device assembling method

The invention relates to a semiconductor device with wettable corner leads and a semiconductor device assembling method. The semiconductor device has wettable corner leads. A semiconductor die is mounted on a lead frame. Die bonding pads are electrically connected to leads of the lead frame. The die and electrical connections are encapsulated with a mold compound. The leads are exposed and flush with the corners of the device. The leads include dimples so that they are wettable, which facilitates inspection when the device is mounted on a circuit board or substrate. 本发明涉及具有可湿拐角引线的半导体器件及半导体器件组装方法。所述半导体器件具有可湿拐角引线。半导体裸片被安装在引线框架上。裸片接合焊盘与所述引线框架的引线电连接。利用模塑复合物封装所述裸片和电连接部。所述引线暴露并与所述器件的所述拐角齐平。所述引线包括使其可湿的凹坑，其有助于在将所述器件安装在电路板或基板上时的检查。