Powder spraying method

A powder spraying method includes enabling a chip to connect with die bond adhesive and to be fixed on a line position of a substrate through a die bond device, performing high temperature die bond, spraying phosphor prepared from nanometer yellow fluorescent powder, nanometer glass micro powder, scaling powder and a solvent on the surface of the chip uniformly through a powder spraying device, and finally performing high temperature solidification. Compared with the prior art, a working procedure of using resin or silicon gel as a fluorescent powder carrier is saved; through spraying the phosphor prepared from nanometer yellow fluorescent powder, nanometer glass micro powder, scaling powder and the solvent on the surface of the chip, yellowing or breakage of the packaging adhesive in longterm high temperature working can be avoided, and the product luminous flux maintenance rate is high. At the same time, by spraying the phosphor on the surface of the chip uniformly by adopting the powder spraying device, an