Bearing platform for wafer with thickness at micron scale

The invention provides a bearing platform for a wafer with the thickness at the micron scale. The bearing platform can realize bearing and protection of the wafer with the thickness at the micron scale and is especially applicable to placement of the wafer and protection of the wafer in a transferring process after one working procedure is completed during wafer processing, quality inspection andproduction. The overall of the bearing platform is cylindrical; a step is formed downward from the top surface of the bearing platform at a position certain distance away from inner circle direction from the edge of the bearing platform, a sunken part is formed downward in the center of the step, an annular surface used for carrying and placing the wafer is formed at the top of the step, the bearing platform also comprises more than three grooves, and the grooves are arranged in the following form: an opening with certain width is formed in the top surface of the bearing platform and the annular surface respectively,