METHOD FOR ATTACHING CERAMIC PHOSPHOR PLATES ON LIGHT-EMITTING DEVICE (LED) DIES USING DICING TAPE, METHOD TO FORM DICING TAPE, AND DICING TAPE

METHOD FOR ATTACHING CERAMIC PHOSPHOR PLATES ON LIGHT-EMITTING DEVICE (LED) DIES USING DICING TAPE, METHOD TO FORM DICING TAPE, AND DICING TAPE

A method includes mounting a ceramic phosphor (102) on an acrylic-free and metal-containing catalyst-free tacky layer (108) of a dicing tape (104), dicing the ceramic phosphor (102) from the dicing tape (104) into ceramic phosphor plates (11)2, removing the ceramic phosphor plates (112) from the dic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SCHRICKER APRIL, ROITMAN DANIEL, VAN LETH NIEK
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method includes mounting a ceramic phosphor (102) on an acrylic-free and metal-containing catalyst-free tacky layer (108) of a dicing tape (104), dicing the ceramic phosphor (102) from the dicing tape (104) into ceramic phosphor plates (11)2, removing the ceramic phosphor plates (112) from the dicing tape (104), and attaching the ceramic phosphor plates (112) on light-emitting device (LED) dies. 种方法，其包含：将陶瓷磷光体（102）安装于切割带（104）的无丙烯酸且无含金属的催化剂的胶粘层（108）上，从切割带（104）将陶瓷磷光体（102）切割成陶瓷磷光板（112），从切割带（104）移除陶瓷磷光板（112），以及将陶瓷磷光板（112）附着在发光器件（LED）管芯上。