SEMICONDUCTOR WAFER, AND SEMICONDUCTOR PACKAGE

A semiconductor wafer includes a substrate structure, a first insulation layer, a conductive layer and a second insulation layer. The substrate structure defines a via. The first insulation layer covers a surface of the substrate structure. The first insulation layer extends into the via, covers a lateral wall of the via and exposes a bottom surface at a bottom of the via. The conductive layer covers the first insulation layer and the bottom surface exposed by the first insulation layer. The second insulation layer covers the conductive layer. A warpage of the semiconductor wafer is less than550 micrometers. 种半导体晶片包含衬底结构、第绝缘层、导电层和第二绝缘层。所述衬底结构界定通孔。所述第绝缘层覆盖所述衬底结构的表面。所述第绝缘层延伸到所述通孔中，覆盖所述通孔的侧壁，且在所述通孔的底部暴露底部表面。所述导电层覆盖所述第绝缘层以及所述第绝缘层所暴露的所述底部表面。所述第二绝缘层覆盖所述导电层。所述半导体晶片的翘曲小于550微米。