Packaging structure of flip chip type filter

The invention relates to a filter, specifically a packaging structure of a flip chip type filter. The packaging structure of the flip chip type filter comprises a substrate, a protection plated layer,a chip and connecting pins, wherein the protection plated layer main body is plate-like, a groove matched with the size of the chip is formed in the central position thereof, and a connecting part isformed in the periphery of the groove; the chip and the substrate are in key connection through the connecting pins; and the protection plated layer is fixed on the substrate through the connecting part, and the chip is packaged in the groove. In the packaging structure, the exterior of the chip is covered with a hollow cavity protection plated layer, so that attachment of an encapsulating adhesive on a transducer on the surface of the chip is prevented, and product performance is improved effectively; and meanwhile, the hollow cavity protection plated layer adopts a metal material, so that ashielding function is real