Etching composition and manufacturing method of organic light emitting display device

An embodiment of the invention provides an etching composition and a manufacturing method of an organic light emitting display device, the etching composition comprises, relative to total weight: 50-70 wt% of phosphoric acid; 0.5-5wt% of nitric acid, 0.1-1wt% of chloride; 0.5-5 wt% of a sulfonic aci...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HYUNCHEOL SHIN, GYUPO KIM, HEESUNG YANG, SANGHYUK LEE, JONGHYUN CHOUNG, BYOUNGWOONG LEE, HONGSICK PARK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NATURAL RESINS NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PAINTS POLISHES SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An embodiment of the invention provides an etching composition and a manufacturing method of an organic light emitting display device, the etching composition comprises, relative to total weight: 50-70 wt% of phosphoric acid; 0.5-5wt% of nitric acid, 0.1-1wt% of chloride; 0.5-5 wt% of a sulfonic acid compound, and 20-40 wt% of water. 本发明的实施例提供种蚀刻液组合物以及有机发光显示装置的制造方法，所述蚀刻液组合物相对于总重量包括：磷酸，50至70重量％；硝酸，0.5至5重量％；氯化物，0.1至1重量％；磺酸化合物，0.5至5重量％；以及水，20至40重量％。