Semiconductor package body and method for manufacturing same

The invention relates to a semiconductor package body. The semiconductor package body comprises a plurality of first parts of first bare cores, a first conductive pattern, at least one second part anda second conductive pattern, wherein the plurality of first parts of the first bare cores are vertically laminated, each first bare core comprises at least one side surface and electrical contact, the electrical contact is exposed out of the side surface, the plurality of first bare cores are aligned to one another so that all side surfaces corresponding to the first bare cores are essentially coplanar relative to one another to form a common side wall, the first conductive pattern is formed on the side wall and is at least partially isolated from the side wall, the electrical contacts of theplurality of bare cores are electrically connected by the first conductive pattern, the second conductive pattern is formed on a surface of the second part, is fixed and is electrically connected tothe first conductive patter