Flip chip assembly as well as flip chip packaging structure and method

The invention provides a flip chip assembly as well as a flip chip packaging structure and method. The flip chip assembly comprises a chip and conductive columns arranged on the surface of the chip, wherein each conductive column comprises a column body connected to the surface of the chip and a soft conductive layer connected to the tail end, away from the chip, of the column body; the flip chipassembly further comprises an insulating layer arranged beside the conductive columns; the soft conductive layers bulge and extend out of the insulating layer in the direction away from the chip. According to the flip chip assembly as well as the flip chip packaging structure and method, product yield is increased by adjusting a production operation mode, and the process technology is more concise; further exploration of product benefits of a chip maker and quality control for follow-up products are facilitated. 本发明提供了种倒装芯片组件、倒装芯片封装结构及封装方法，所述倒装芯片组件包括芯片及设置于芯片表面的导电柱；所述导电柱包括连接至芯片表面的柱体及连接至柱体背离芯片的末端的软质导电层，所述倒装芯片组件还包括设置在所述导