Method for detecting sealing properties of electronic components

The invention belongs to the technical field of detection of electronic components, and particularly relates to a method for detecting the sealing properties of electronic components. The method detects an entire circuit board and comprises steps of: determining the applying pressure and pressurization time before a test, wherein the applying pressure of a pressure chamber should be the minimum value of the typical applying pressure that can be withstood by all the tested electronic components in order that all the tested electronic components cannot be damaged due to the excessive applying pressure; determining suitable pressurization time by a test in order that the detection sensitivity of each tested electronic component meets a detection requirement; and finally, calculating the leakage rate of each electronic component by a tester. The method can detect the sealing properties of a plurality of electronic components installed on a circuit board. Compared with the prior art, the detection method of the pr