Formula and processing technology of pumpkin submicron powder thin pancakes
The invention relates to the field of food processing, and provides a formula of pumpkin submicron powder thin pancakes. The formula consists of the following raw materials in parts by weight of 480-520 parts of flour, 880-1000 parts of coarse wheat flour, 900-1020 parts of millet flour, 35-43 parts...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the field of food processing, and provides a formula of pumpkin submicron powder thin pancakes. The formula consists of the following raw materials in parts by weight of 480-520 parts of flour, 880-1000 parts of coarse wheat flour, 900-1020 parts of millet flour, 35-43 parts of pumpkin submicron powder and 2000-2300 parts of purified water, and preferably 500 parts of theflour, 1000 parts of the coarse wheat flour, 1000 parts of millet flour, 40 parts of the pumpkin submicron powder and 2000 parts of the purified water. The pumpkin submicron powder thin pancakes disclosed by the invention are uniform, fine and smooth in structure, crisp and chewable in mouth feel, greenish-yellow in color, fragrant and sweet after being put into mouths, rich in aftertaste, slightin pumpkin fragrance and high in nutrient value, can facilitate digestion and promote absorption, are suitable for crowds of different age stages to eat, and are particularly suitable for crowds poorin the digestion functions |
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