Earphone

The invention discloses an earphone. A sound cavity shell of the earphone is arranged between a loudspeaker and a circuit board, the sound cavity shell is provided with a sound cavity for accommodating the loudspeaker, the sound cavity shell is provided with a mounting hole communicating with the so...

Ausführliche Beschreibung

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1. Verfasser: DUAN SHENGMEI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses an earphone. A sound cavity shell of the earphone is arranged between a loudspeaker and a circuit board, the sound cavity shell is provided with a sound cavity for accommodating the loudspeaker, the sound cavity shell is provided with a mounting hole communicating with the sound cavity, a conductive part is arranged between the loudspeaker and the circuit board to realize electric conduction, the conductive part is at least partially accommodated in the sound cavity, one end of the conductive part abuts against and forms electric conduction with the loudspeaker, and theother end of the conductive part penetrates through the mounting hole and abuts against and forms electric conduction with the circuit board. The loudspeaker and the circuit board of the earphone areconducted through the conductive part, compared with the traditional manner of welding the loudspeaker and the circuit board through wires, the electric conduction structure of the loudspeaker of theearphone is simplified, th