Preparation method of polyimide ink for 3D printing

The invention relates to a preparation method of polyimide ink for 3D printing. sol-gel is combined with a 3D printing technology, diamine and dianhydride monomers are added to a catalyst to synthesize a polyamide acid solution, silica is added to form polyamide acid sol, the silica and the polyamid...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WU SHUAI, GE YINGTING, DU AI, ZHOU BIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The invention relates to a preparation method of polyimide ink for 3D printing. sol-gel is combined with a 3D printing technology, diamine and dianhydride monomers are added to a catalyst to synthesize a polyamide acid solution, silica is added to form polyamide acid sol, the silica and the polyamide acid sol are stirred to form the high-concentration polyimide ink, and the polyimide ink is printed by adopting the 3D printing technology to obtain low-density polyimide gel. The molecular structure is modified to achieve fusion and good processability, and the high-performance polyimide sol is obtained through the 3D printing technology. Polyimide aerogel prepared in the invention has excellent resistance to the high temperature and corrosion, and has a high mechanical strength. Like ultralow-density polyimide aerogel has a good electric conductivity and a high compressibility, can be applied to the spaceflight field to prepare lightweight and high temperature-resistant materials, can beapplied to the wireless