HIGH-FREQUENCY MODULE AND METHOD FOR PRODUCING SAME
High-frequency module and method for producing same are provided. In a high-frequency module provided with a shielding film that shields a part from unnecessary electromagnetic waves from the outside,the adhesion strength of the shielding film is improved. This high-frequency module 1a is provided w...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | High-frequency module and method for producing same are provided. In a high-frequency module provided with a shielding film that shields a part from unnecessary electromagnetic waves from the outside,the adhesion strength of the shielding film is improved. This high-frequency module 1a is provided with: a sealing body 12 having a multilayer wiring board 2, a part 3 mounted on the upper surface 20a of the multilayer wiring board 2, and a sealing resin layer 4 that is stacked on the upper surface 20a of the multilayer wiring board 2 and covers the part 3; and a shielding film 5 that covers thesurface of the sealing resin layer 4. A side of the sealing body 12 has a curved surface section 12b formed in a curved surface shape, and the curved surface section 12b is roughened by a plurality ofgrooves 10a.
本发明涉及高频模块及其制造方法。在具备屏蔽从外部针对部件的不必要的电磁波的屏蔽膜的高频模块中提高屏蔽膜的密合强度。高频模块(1a)具备密封体(12)和屏蔽膜(5),该密封体(12)具有多层布线基板(2)、被安装在该多层布线基板(2)的上面(20a)的部件(3)以及被层叠在多层布线基板(2)的上面(20a)并覆盖部件(3)的密封树脂层(4),该屏蔽膜(5)包覆密封树脂层(4)的表面,密封体(12)的侧面具有形成为曲面状的曲面 |
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