Ceramic substrate for UV LED inorganic packaging and manufacturing method thereof

The invention relates to a ceramic substrate for UV LED inorganic packaging and a manufacturing method thereof. The manufacturing method thereof comprises the following steps: a first metal layer is printed on a first surface of the ceramic substrate having via holes; a second metal layer is printed on a second surface opposite to the first surface, an electric conduction line is formed, a bondingpad area is formed on the first surface, thickness of the second metal layer is greater than that of the first metal layer, distance between the first surface and the second surface is greater than or equal to 0 .5mm, and a solder layer is printed on the bonding pad area to be attached with a packaging frame on the first surface. A packaging frame is attached to the solder layer. A ceramic metalliner plate attached with the packaging frame is sintered under vacuum conditions. Via adoption of the ceramic base for UV LED inorganic packaging and the manufacturing method thereof, residual stresscaused by the asymmetrical