Wet polishing process

The invention discloses a wet polishing process, which comprises the steps of placing a device to be polished onto a working platform of a polishing device, and polishing. The polishing device comprises a polish grinding head and a spraying pipe, wherein a through hole is formed in the middle part of the polish grinding head; the spraying pipe is held in the through hole; and during polishing, a polishing solution is sprayed out from the middle part of the polish grinding head through the spraying pipe. Through the manner, the wet polishing process provided by the invention can be beneficial to improving the efficiency of the polishing process. 本发明公开了种湿法抛光工艺，所述湿法抛光工艺包括：将待抛光器件放置在抛光设备的工作平台上进行抛光处理；其中，抛光设备包括抛光磨头和喷淋管，抛光磨头的中部设置通孔，喷淋管收容于通孔内，抛光处理时，抛光液通过喷淋管从抛光磨头中部喷出。通过上述方式，本发明能够提高抛光工艺的效率。