ELECTRONIC SYSTEMS WITH THROUGH-SUBSTRATE INTERCONNECTS AND MEMS DEVICE

Disclosed are systems, methods, and computer program products for electronic systems with through-substrate interconnects and mems device. An interconnect formed in a substrate having a first surfaceand a second surface, the interconnect INC.ludes: a bulk region; a via extending from the first surface to the second surface; an insulating structure extending through the first surface into the substrate and defining a closed loop around the via, wherein the insulating structure comprises a seam portion separated by at least one solid portion; and an insulating region extending from the insulating structure toward the second surface, the insulating region separating the via from the bulk region, wherein the insulating structure and insulating region collectively provide electrical isolationbetween the via and the bulk region. 公开了针对具有贯穿基板的互连和MEMS器件的电子系统的系统、方法和计算机程序产品。种在具有第表面和第二表面的基板中形成的互连，所述互连包括：块状区域；从第表面延伸到第二表面的通孔；延伸穿过第表面进入基板并且限定围绕通孔的闭环的绝缘结构，其中绝缘结构包括由至少个实心部分分隔的接缝部分；以及从绝缘结构朝着第二表面延伸的绝缘区域，该绝缘区域将通孔与块状区域分隔，其中绝缘结构和绝缘区