Copper-based embedded combination heat sink and fabrication method thereof

The invention belongs to the field of a heat dissipation management material, and discloses a copper-based embedded combination heat sink and a fabrication method thereof. The copper-based embedded combination heat sink comprises a CuCr substrate and a combination layer of a CuCr substrate surface layer, wherein the combination layer is formed by embedding diamond powder into the CuCr substrate surface layer. The product is obtained by evaporating a layer of stearic acid film on a surface of the pre-processed CuCr substrate, settling the diamond powder onto a surface of thestearic acid film, half-pressing diamond particles into the substrate by room-temperature die pressing, fully pressing the diamond particles on the surface of the CuCr substrate into the substrate by a method of hot die pressing and performing diffusion and annealing. By the copper-based embedded combination heat sink, a V-shaped groove in a diamond/substrate interface is basically eliminated, the diamond particles