MANUFACTURING PROCESS OF ELEMENTAL CHIP

The present invention discloses a manufacturing process of an elemental chip by forming a slushing compound on a substrate held on the holding tape and etching the substrate through a plasma. The process comprises steps of: preparing a substrate held on the holding tape, the substrate including first and second sides opposite each other and the second side thereof being held on the holding tape, and the substrate further including a plurality of element regions and a plurality of segmentation regions defining each of the element regions; spraying a resist solution to form droplets of the resist solution, the resist solution containing a resist constituent and a solvent; forming a resist layer by vaporizing the solvent from the droplets and depositing the resist constituent on the first side of the substrate that is held on the holding tape; patterning the resist layer to expose the first side of the substrate in the segmentation regions; and performing plasma-etching of the first sideof the substrate exposed