Resin composition and multilayer substrate

Provided is a resin composition whereby the bend characteristics and cutting processability of a B-stage film can be increased, the dielectric loss tangent of a cured material can be reduced, and thethermal dimensional stability of a cured material can be increased. The resin composition pertaining...

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Bibliographische Detailangaben
Hauptverfasser:	BABA SUSUMU, HAYASHI TATSUSHI, KOUYANAGI HIROSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided is a resin composition whereby the bend characteristics and cutting processability of a B-stage film can be increased, the dielectric loss tangent of a cured material can be reduced, and thethermal dimensional stability of a cured material can be increased. The resin composition pertaining to the present invention includes an epoxy compound, a curing agent, and an inorganic filler, the epoxy compound including 1 wt% to 10 wt% of a liquid epoxy compound having a viscosity at 25 DEG C of 500 mPa.s or less, with respect to a total of 100 wt% of the epoxy compound. 本发明提供种树脂组合物，其可以提高B级膜的弯曲特性及切断加工性，可以降低固化物的介电损耗角正切，且提高固化物的热尺寸稳定性。本发明的树脂组合物含有环氧化合物、固化剂以及无机填充材料，上述环氧化合物含有在25℃下的粘度为500mPa·s以下的液态环氧化合物，上述液态环氧化合物在上述环氧化合物总量100重量％中的含量为1重量％以上、10重量％以下。