Balanced Multi-Layer Printed Circuit Board for Phased-Array Antenna

A phased-array antenna assembly includes an antenna board stack, a radome configured to cover the antenna board stack, and a casing configured to support the antenna board stack. The antenna board stack includes a central core, a bottom antenna unit defining a bottom thickness between a bottom surfa...

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Hauptverfasser: FELDMAN ARNOLD R, SWIRHUN PAUL, BANNON ROY MICHAEL, HUSTED PAUL JAMES, NOUJEIM LEESA MARIE, MOLONEY DAVE, BUCKLEY MICHAEL J
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A phased-array antenna assembly includes an antenna board stack, a radome configured to cover the antenna board stack, and a casing configured to support the antenna board stack. The antenna board stack includes a central core, a bottom antenna unit defining a bottom thickness between a bottom surface of the central core and a bottom end of the antenna board stack, and a top antenna unit defininga top thickness between a top surface of the central core and the top end of the antenna board stack that is substantially equal to the bottom thickness. The bottom antenna unit includes two spaced apart bottom metal layers each associated with a different distance from the axis of symmetry. The top antenna unit includes two spaced apart top metal layers each associated with a corresponding one ofthe distances from the axis of symmetry associated with the bottom metal layers. 相控阵天线组件(100,100a-d)包括天线板堆栈(200)、被配置为覆盖天线板堆栈的天线罩(102)以及被配置为支撑天线板堆栈的壳体(110)。天线板堆栈包括中央核心层(214a)、限定底部厚度(T)的底部多层天线单元(208)以及限定顶部厚度(T)的顶部多层天线单元(206)。底部