Heat dissipation water cooling bank structure

The invention provides a heat dissipation water cooling bank structure including a first cover piece, a second cover piece and multiple heat dissipation pieces stacking into a heat dissipation water cooling bank body. The first cover piece, the second cover piece and the multiple heat dissipation pi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	QIU RONGYI, ZHANG FUGUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention provides a heat dissipation water cooling bank structure including a first cover piece, a second cover piece and multiple heat dissipation pieces stacking into a heat dissipation water cooling bank body. The first cover piece, the second cover piece and the multiple heat dissipation pieces are stacked in sequence and are integrated into a whole through a heat treatment method. One side of the first cover piece and one side of the second cover piece are connected to the upper side and the lower side of the heat dissipation water cooling bank body so as to seal the top side and thebottom side of a flow channel therein provided with multiple turbulent flow zones and formed in the heat dissipation water cooling bank body. A first combination part can be selectively arranged on the first cover piece or one end of the heat dissipation water cooling bank body. A second combination part can be selectively arranged on the first cover piece or the other end of the heat dissipationwater cooling bank body.