POWER CONVERSION APPARATUS PROVIDED WITH SEMICONDUCTOR MODULE AND ELECTRONIC COMPONENT PRESSURIZED BY PRESSURIZING MEMBER

A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electron...

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Bibliographische Detailangaben
Hauptverfasser: TAKASHI KAWASHIMA, RYOTA TANABE, MASAHIRO KONDOU, TAKASHI YANBE, NAOKI HIRASAWA
Format: Patent
Sprache:chi ; eng
Schlagworte:
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