POWER CONVERSION APPARATUS PROVIDED WITH SEMICONDUCTOR MODULE AND ELECTRONIC COMPONENT PRESSURIZED BY PRESSURIZING MEMBER

A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction. 种电力转换装置，包括半导体模块、电子部件、多个冷却管以及壳体，上述壳体对上述半导体模块、上述电子部件及上述冷却管进行收容。抵接面设置于上述壳体的部分，其中，上述电子部件与上述抵接面接触。加压构件在第方向上对上述半导体模块进行加压，上述加压构件从上述半导体模块朝上述电子部件延伸。上述电子部件包括部件主体和翼部，上述翼部在上述