Electronic circuit device and manufacturing method thereof

The invention relates to an electronic circuit device and a manufacturing method thereof. In the method, a forming die having a first die (13) and a second die (14) configured opposite to the first die (13) is used for carrying resin forming on a substrate (2) equipped with an electronic part (3) so as to manufacture an electronic circuit device of a structure shielded by a shielding component ofan electronic part (3). The method comprises steps of preparing a conductive plate-shaped component (19) and a conductive frame-shaped component (11) to serve as shielding components, wherein the frame-shaped component (11) comprises a bending part (12) and by bending at least one end part of the frame-shaped component (11), the bending part is formed and is set to be elastically deformable; and forming resin. Under the state that the substrate (2), the frame-shaped component (11) and the plate-shaped component (19) are successively configured between the first die (13) and the second die (14), and the bending part (1