Mounting method and mounting apparatus of electronic parts
The invention provides a mounting method and mounting apparatus for electronic parts. The mounting apparatus can perform position correction in very high accuracy when a hot substrate is installed andthe mounting apparatus is mounted in the substrate; the mounting apparatus for the electronic part i...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a mounting method and mounting apparatus for electronic parts. The mounting apparatus can perform position correction in very high accuracy when a hot substrate is installed andthe mounting apparatus is mounted in the substrate; the mounting apparatus for the electronic part includes an installation head which maintains the electronic member and installs the electronic parton the installation substrate, an absorbing installation substrate an a rack (2) which is opposite to the installation head and can be absorbed to the installation substrate and can calibrate the rack of the substrate; a driving mechanism enabling the the installation head or the rack to move relatively to a transverse direction which is intersected with a vertical direction and a plurality of cameras (4a,4b) which can shoot an image comprising an area (43) of a corresponding part (Gi) of at least one installation position of the calibration substrate which is absorbed to the rack.
本发明提供电子部件的安装方法以及装置,能在边加热安装基板边安装的情况下以 |
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