Coefficient of thermal expansion (cte) matched transistor outline (to) header

A transistor outline (TO) package may include a TO cap. The TO package may include a TO header. The TO header may include a header stem of a first material and a first coefficient of thermal expansion(CTE) value. The TO header may include a header base of a second material and a second CTE value. The first material and the second material may be different. The first CTE value and the second CTE value may be different. The first CTE value and the second CTE value may be within a threshold percentage of each other. 晶体管轮廓(TO)封装可包括TO帽。TO封装可包括TO标头。TO标头可包括第材料制成的具有第热膨胀系数(CTE)值的标头杆。TO标头可包括第二材料制成的具有第二CTE值的标头基部。第材料和第二材料可以是不同的。第CTE值和第二CTE值可以是不同的。第CTE值和第二CTE值可以在彼此的阈限百分比内。