Lead frame and method of fabricating the same

A lead frame is provided, including one or more power terminals and one or more control terminals, wherein at least one of the control terminals is externally terminated with a press-fit contact member, and wherein at least one of the control terminals and at least one power terminals are formed fro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PAULSEN, LARS, BEER, HOLGER
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A lead frame is provided, including one or more power terminals and one or more control terminals, wherein at least one of the control terminals is externally terminated with a press-fit contact member, and wherein at least one of the control terminals and at least one power terminals are formed from different materials. With the disclosed lead frame of the invention, lower material cross sectionsin the power terminals will be provided because of the better electrical conductivity when using pure copper compared to alloys with higher mechanical strengths. Also specific/different plating couldbe added to the individual needs of the different pin types without using masks in the plating process. 提供种引线框架,该引线框架包括个或多个电源端子和个或多个控制端子,其中,所述控制端子中的至少个控制端子在外部终止于压配合接触部构件,并且其中所述控制端子中的至少个控制端子和至少个电源端子由不同的材料形成。利用本发明所公开的引线框架,由于与具有较高机械强度的合金相比当使用纯铜时具有较好的导电性,因此将提供在电源端子中的较低材料截面。此外,在镀覆过程中无需掩膜的情况下,特定/不同的镀覆可以添加到不同引脚类型的单独需求中。