Substrate processing method, substrate processing apparatus and storage medium

The invention relates to a substrate processing apparatus, a substrate processing method, and a storage medium which are effective for improving the uniformity of a film thickness of a coating film. Acoating and developing apparatus (2) according to the present disclosure includes: a nozzle (22) that ejects a processing liquid to a wafer; a force-feeding unit (40) that force-feeds the processingliquid to the nozzle side; a liquid feeding pipeline (50) that includes first and second valves (53, 54) and guides the processing liquid from the force-feeding unit to the nozzle; and a controller (100). The controller is configured to perform opening the first valve (53) in a state where the second valve (54) is closed and a pressure between the first and second valves (53, 54) is higher than apressure between the force-feeding unit and the first valve (53), controlling the force-feeding unit to increase the pressure between the first and second valves (53, 54) that has been decreased by the opening of the first valv