Method of inspecting surface and method of manufacturing semiconductor device

Provided are a method of inspecting a surface and a method of manufacturing a semiconductor device. The methods include preparing a substrate, selecting a spatial resolution of a first optical deviceby setting magnification of an imaging optical system, emitting multi-wavelength light toward a first measurement area of the substrate and obtaining first wavelength-specific images, generating firstspectrum data based on the first wavelength-specific images, generating first spectrum data of respective pixels based on the first wavelength-specific images, and extracting a spectrum of at least one first inspection area having a range of the first measurement area or less from the first spectrum data, and analyzing the spectrum. The first optical device includes a light source, an objective lens, a detector, and an imaging optical system. The obtaining of first wavelength-specific images includes using the imaging optical system and the detector. 提供了检查表面的方法和制造半导体器件的方法。所述的方法包括：制备基板；通过设定成像光学系统的放大倍率选择第光学装置的空间分辨率；朝向基板