PCB preparation method and PCB structure
The invention provides a PCB preparation method and a PCB structure. The preparation method comprises that a groove hole is formed in the preset position of a pressing plate, the pressing plate comprises a PCB area including a pattern to be plated and an electroplating lead area, the preset position...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a PCB preparation method and a PCB structure. The preparation method comprises that a groove hole is formed in the preset position of a pressing plate, the pressing plate comprises a PCB area including a pattern to be plated and an electroplating lead area, the preset position is located at the end of the to-be-plated pattern and located at the edge of the electroplating lead area; the hole metallization processing is performed on the groove hole; an electroplating lead is formed on the inner surface of the groove hole, and an electroplating bus connected to the electroplating lead area is led out; a gold finger is formed after the to-be-plated pattern is plated through the electroplating lead, and the gold finger comprises a metal layer which is close to one side surface of the PCB area in the groove hole; and the electroplating lead area is milled to form a PCB with the gold finger. According to the PCB preparation method and the PCB structure, the gold fingergraph extends to the side |
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