Manufacturing method of target material assembly

The invention discloses a manufacturing method of a target material assembly. The manufacturing method comprises the steps that a silicon carbide target billet and a backboard are provided, wherein the silicon carbide target billet is provided with a first surface connected with the backboard, and the backboard is provided with a second surface connected with the silicon carbide target billet; indium solder is provided; and the indium solder is adopted, and the first surface and the second surface are welded through braze welding. In the technical scheme, the silicon carbide target billet andthe backboard are welded through the indium solder, and the target material assembly is formed; and compared with solder adopted in the prior art, the indium solder has the advantages that after cooling solidification, hardness is relatively small, the indium solder is liable to perform plastic deformation and has a certain buffer function between the silicon carbide target billet and the backboard, the phenomenon that th