Optical emitter packages

An optical emitter package is disclosed. The optical emitter package can include a carrier, a switching die, and an optical emitter die mounted to the carrier. The optical emitter die can be directlyelectrically and mechanically connected to the carrier with a conductive adhesive. An energy storage...

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Hauptverfasser: MICHAEL J. ZYLINSKI, ERIC P. CHOJNACKI, ERIK D. BARNES
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Sprache:chi ; eng
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creator MICHAEL J. ZYLINSKI
ERIC P. CHOJNACKI
ERIK D. BARNES
description An optical emitter package is disclosed. The optical emitter package can include a carrier, a switching die, and an optical emitter die mounted to the carrier. The optical emitter die can be directlyelectrically and mechanically connected to the carrier with a conductive adhesive. An energy storage device can be mounted to the carrier. The energy storage device can be directly electrically and mechanically connected to the carrier with a second conductive adhesive. The carrier can provide electrical communication between the switching die, the optical emitter die, and the energy storage device. 公开光发射器封装件。光发射器封装件可包括载体、开关芯片以及安装至载体的光发射器芯片。光发射器芯片可使用导电粘合剂直接电气和机械连接载体。储能装置可安装至载体。储能装置可使用第二导电粘合剂直接电气和机械连接载体。载体可以在开关芯片、光发射器芯片和储能装置之间提供电气通讯。
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The optical emitter die can be directlyelectrically and mechanically connected to the carrier with a conductive adhesive. An energy storage device can be mounted to the carrier. The energy storage device can be directly electrically and mechanically connected to the carrier with a second conductive adhesive. The carrier can provide electrical communication between the switching die, the optical emitter die, and the energy storage device. 公开光发射器封装件。光发射器封装件可包括载体、开关芯片以及安装至载体的光发射器芯片。光发射器芯片可使用导电粘合剂直接电气和机械连接载体。储能装置可安装至载体。储能装置可使用第二导电粘合剂直接电气和机械连接载体。载体可以在开关芯片、光发射器芯片和储能装置之间提供电气通讯。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRICITY</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180223&amp;DB=EPODOC&amp;CC=CN&amp;NR=107732651A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180223&amp;DB=EPODOC&amp;CC=CN&amp;NR=107732651A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MICHAEL J. 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The carrier can provide electrical communication between the switching die, the optical emitter die, and the energy storage device. 公开光发射器封装件。光发射器封装件可包括载体、开关芯片以及安装至载体的光发射器芯片。光发射器芯片可使用导电粘合剂直接电气和机械连接载体。储能装置可安装至载体。储能装置可使用第二导电粘合剂直接电气和机械连接载体。载体可以在开关芯片、光发射器芯片和储能装置之间提供电气通讯。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDwLyjJTE7MUUjNzSwpSS1SKEhMzk5MTy3mYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxUBlqXmpJfHOfoYG5ubGRmamho7GxKgBAPUHIkQ</recordid><startdate>20180223</startdate><enddate>20180223</enddate><creator>MICHAEL J. ZYLINSKI</creator><creator>ERIC P. CHOJNACKI</creator><creator>ERIK D. BARNES</creator><scope>EVB</scope></search><sort><creationdate>20180223</creationdate><title>Optical emitter packages</title><author>MICHAEL J. ZYLINSKI ; ERIC P. 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subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
title Optical emitter packages
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