Optical emitter packages
An optical emitter package is disclosed. The optical emitter package can include a carrier, a switching die, and an optical emitter die mounted to the carrier. The optical emitter die can be directlyelectrically and mechanically connected to the carrier with a conductive adhesive. An energy storage...
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creator | MICHAEL J. ZYLINSKI ERIC P. CHOJNACKI ERIK D. BARNES |
description | An optical emitter package is disclosed. The optical emitter package can include a carrier, a switching die, and an optical emitter die mounted to the carrier. The optical emitter die can be directlyelectrically and mechanically connected to the carrier with a conductive adhesive. An energy storage device can be mounted to the carrier. The energy storage device can be directly electrically and mechanically connected to the carrier with a second conductive adhesive. The carrier can provide electrical communication between the switching die, the optical emitter die, and the energy storage device.
公开光发射器封装件。光发射器封装件可包括载体、开关芯片以及安装至载体的光发射器芯片。光发射器芯片可使用导电粘合剂直接电气和机械连接载体。储能装置可安装至载体。储能装置可使用第二导电粘合剂直接电气和机械连接载体。载体可以在开关芯片、光发射器芯片和储能装置之间提供电气通讯。 |
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公开光发射器封装件。光发射器封装件可包括载体、开关芯片以及安装至载体的光发射器芯片。光发射器芯片可使用导电粘合剂直接电气和机械连接载体。储能装置可安装至载体。储能装置可使用第二导电粘合剂直接电气和机械连接载体。载体可以在开关芯片、光发射器芯片和储能装置之间提供电气通讯。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRICITY</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180223&DB=EPODOC&CC=CN&NR=107732651A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180223&DB=EPODOC&CC=CN&NR=107732651A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MICHAEL J. ZYLINSKI</creatorcontrib><creatorcontrib>ERIC P. CHOJNACKI</creatorcontrib><creatorcontrib>ERIK D. BARNES</creatorcontrib><title>Optical emitter packages</title><description>An optical emitter package is disclosed. The optical emitter package can include a carrier, a switching die, and an optical emitter die mounted to the carrier. The optical emitter die can be directlyelectrically and mechanically connected to the carrier with a conductive adhesive. An energy storage device can be mounted to the carrier. The energy storage device can be directly electrically and mechanically connected to the carrier with a second conductive adhesive. The carrier can provide electrical communication between the switching die, the optical emitter die, and the energy storage device.
公开光发射器封装件。光发射器封装件可包括载体、开关芯片以及安装至载体的光发射器芯片。光发射器芯片可使用导电粘合剂直接电气和机械连接载体。储能装置可安装至载体。储能装置可使用第二导电粘合剂直接电气和机械连接载体。载体可以在开关芯片、光发射器芯片和储能装置之间提供电气通讯。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDwLyjJTE7MUUjNzSwpSS1SKEhMzk5MTy3mYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxUBlqXmpJfHOfoYG5ubGRmamho7GxKgBAPUHIkQ</recordid><startdate>20180223</startdate><enddate>20180223</enddate><creator>MICHAEL J. ZYLINSKI</creator><creator>ERIC P. CHOJNACKI</creator><creator>ERIK D. BARNES</creator><scope>EVB</scope></search><sort><creationdate>20180223</creationdate><title>Optical emitter packages</title><author>MICHAEL J. ZYLINSKI ; ERIC P. CHOJNACKI ; ERIK D. BARNES</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN107732651A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>MICHAEL J. ZYLINSKI</creatorcontrib><creatorcontrib>ERIC P. CHOJNACKI</creatorcontrib><creatorcontrib>ERIK D. BARNES</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MICHAEL J. ZYLINSKI</au><au>ERIC P. CHOJNACKI</au><au>ERIK D. BARNES</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Optical emitter packages</title><date>2018-02-23</date><risdate>2018</risdate><abstract>An optical emitter package is disclosed. The optical emitter package can include a carrier, a switching die, and an optical emitter die mounted to the carrier. The optical emitter die can be directlyelectrically and mechanically connected to the carrier with a conductive adhesive. An energy storage device can be mounted to the carrier. The energy storage device can be directly electrically and mechanically connected to the carrier with a second conductive adhesive. The carrier can provide electrical communication between the switching die, the optical emitter die, and the energy storage device.
公开光发射器封装件。光发射器封装件可包括载体、开关芯片以及安装至载体的光发射器芯片。光发射器芯片可使用导电粘合剂直接电气和机械连接载体。储能装置可安装至载体。储能装置可使用第二导电粘合剂直接电气和机械连接载体。载体可以在开关芯片、光发射器芯片和储能装置之间提供电气通讯。</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRICITY |
title | Optical emitter packages |
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