Optical emitter packages
An optical emitter package is disclosed. The optical emitter package can include a carrier, a switching die, and an optical emitter die mounted to the carrier. The optical emitter die can be directlyelectrically and mechanically connected to the carrier with a conductive adhesive. An energy storage...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | An optical emitter package is disclosed. The optical emitter package can include a carrier, a switching die, and an optical emitter die mounted to the carrier. The optical emitter die can be directlyelectrically and mechanically connected to the carrier with a conductive adhesive. An energy storage device can be mounted to the carrier. The energy storage device can be directly electrically and mechanically connected to the carrier with a second conductive adhesive. The carrier can provide electrical communication between the switching die, the optical emitter die, and the energy storage device.
公开光发射器封装件。光发射器封装件可包括载体、开关芯片以及安装至载体的光发射器芯片。光发射器芯片可使用导电粘合剂直接电气和机械连接载体。储能装置可安装至载体。储能装置可使用第二导电粘合剂直接电气和机械连接载体。载体可以在开关芯片、光发射器芯片和储能装置之间提供电气通讯。 |
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