Ultra-light thermal-insulation board

The present invention discloses an ultra-light thermal-insulation board. The thermal-insulation board comprises 10-13 parts by mass of sodium phosphate, 11-14 parts by mass of clay, 12-15 parts by mass of sodium silicate, 9-11 parts by mass of fine silicon powder, 13-16 parts by mass of zinc oxide,...

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Bibliographische Detailangaben
1. Verfasser:	PU XUEPING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ARTIFICIAL STONE CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE LIME, MAGNESIA METALLURGY REFRACTORIES SLAG TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	The present invention discloses an ultra-light thermal-insulation board. The thermal-insulation board comprises 10-13 parts by mass of sodium phosphate, 11-14 parts by mass of clay, 12-15 parts by mass of sodium silicate, 9-11 parts by mass of fine silicon powder, 13-16 parts by mass of zinc oxide, 9-12 parts by mass of aluminum oxide, and a coupling agent. 本发明公开了种超轻保温板，该保温板组分包括：磷酸钠10~13质量份，黏土11~14质量份，水玻璃12~15质量份，硅微粉9~11质量份，氧化锌13~16质量份，氧化铝9~12质量份，偶联剂。